TSMC to build new 8-inch fab capacity

发表于2018-12-10

  1. Taiwan Semiconductor Manufacturing Company (TSMC) has disclosed plans to build a new 8-inch wafer fab at its manufacturing site in Tainan, southern Taiwan to satisfy robust customer demand.

    TSMC's last 8-inch fab was established about 15 years ago.

    Plans to add a new 8-inch fabrication facility is to meet growing customer demand for specialty process technologies, according to TSMC CEO CC Wei.

    TSMC continues to focus on its advanced process technology leadership. The company is scheduled to move a newer 5nm node to risk production in the second quarter of 2019, followed by volume production a year later, Wei noted.

    Wei reiterated TSMC's target for a 5-10% compound annual growth rate (CAGR) for revenues through 2021. Meanwhile, annual capex through 2021 will be maintained at between US$10 billion and US$12 billion, Wei continued.

    According to IC Insights, TSMC is ranked the world's fourth-largest spender trailing IDMs including Samsung, Intel and SK Hynix. TSMC's capex for 2018 is estimated at US$10.25 billion, down 5% from the US$10.85 billion allocated last year.